磁控靶

磁控濺射包括很多種類(lei)。各(ge)有(you)不同(tong)工作原理和應用對象。但有(you)一(yi)共同(tong)點：利用磁場與(yu)電場交互作用，使(shi)電子(zi)在靶表面附(fu)近(jin)成螺旋(xuan)狀(zhuang)運行，從而(er)增大電子(zi)撞(zhuang)擊氬(ya)氣產生離子(zi)的概率。所產生的離子(zi)在電場作用下撞(zhuang)向靶面從而(er)濺射出(chu)靶材。

靶(ba)(ba)(ba)(ba)源分(fen)平(ping)(ping)(ping)衡(heng)式(shi)和(he)(he)非平(ping)(ping)(ping)衡(heng)式(shi)，平(ping)(ping)(ping)衡(heng)式(shi)靶(ba)(ba)(ba)(ba)源鍍膜(mo)均勻，非平(ping)(ping)(ping)衡(heng)式(shi)靶(ba)(ba)(ba)(ba)源鍍膜(mo)膜(mo)層和(he)(he)基(ji)體(ti)(ti)結合(he)力(li)(li)(li)強。平(ping)(ping)(ping)衡(heng)靶(ba)(ba)(ba)(ba)源多用(yong)(yong)(yong)于(yu)(yu)半導(dao)體(ti)(ti)光(guang)學膜(mo)，非平(ping)(ping)(ping)衡(heng)多用(yong)(yong)(yong)于(yu)(yu)磨(mo)損裝飾膜(mo)。磁(ci)(ci)(ci)(ci)控(kong)陰(yin)(yin)極(ji)按照磁(ci)(ci)(ci)(ci)場(chang)(chang)(chang)位形(xing)分(fen)布(bu)不同，大(da)(da)致可(ke)(ke)分(fen)為(wei)平(ping)(ping)(ping)衡(heng)態(tai)磁(ci)(ci)(ci)(ci)控(kong)陰(yin)(yin)極(ji)和(he)(he)非平(ping)(ping)(ping)衡(heng)態(tai)磁(ci)(ci)(ci)(ci)控(kong)陰(yin)(yin)極(ji)。平(ping)(ping)(ping)衡(heng)態(tai)磁(ci)(ci)(ci)(ci)控(kong)陰(yin)(yin)極(ji)內外磁(ci)(ci)(ci)(ci)鋼的磁(ci)(ci)(ci)(ci)通(tong)量大(da)(da)致相等(deng)，兩極(ji)磁(ci)(ci)(ci)(ci)力(li)(li)(li)線(xian)(xian)閉(bi)合(he)于(yu)(yu)靶(ba)(ba)(ba)(ba)面，很好(hao)地將電子(zi)等(deng)離(li)(li)(li)子(zi)體(ti)(ti)約(yue)束在靶(ba)(ba)(ba)(ba)面附近，增(zeng)加了(le)碰(peng)撞幾率(lv)(lv)，提高(gao)了(le)離(li)(li)(li)化效(xiao)率(lv)(lv)，因而在較低的工(gong)作(zuo)氣(qi)壓(ya)(ya)和(he)(he)電壓(ya)(ya)下就能起(qi)輝并維持輝光(guang)放電，靶(ba)(ba)(ba)(ba)材利(li)用(yong)(yong)(yong)率(lv)(lv)相對較高(gao)。但由(you)于(yu)(yu)電子(zi)沿(yan)磁(ci)(ci)(ci)(ci)力(li)(li)(li)線(xian)(xian)運動主要閉(bi)合(he)于(yu)(yu)靶(ba)(ba)(ba)(ba)面，基(ji)片(pian)區域所受(shou)離(li)(li)(li)子(zi)轟擊(ji)較小(xiao)。非平(ping)(ping)(ping)衡(heng)磁(ci)(ci)(ci)(ci)控(kong)濺(jian)射技術，即(ji)讓磁(ci)(ci)(ci)(ci)控(kong)陰(yin)(yin)極(ji)外磁(ci)(ci)(ci)(ci)極(ji)磁(ci)(ci)(ci)(ci)通(tong)大(da)(da)于(yu)(yu)內磁(ci)(ci)(ci)(ci)極(ji)，兩極(ji)磁(ci)(ci)(ci)(ci)力(li)(li)(li)線(xian)(xian)在靶(ba)(ba)(ba)(ba)面不完全閉(bi)合(he)，部(bu)分(fen)磁(ci)(ci)(ci)(ci)力(li)(li)(li)線(xian)(xian)可(ke)(ke)沿(yan)靶(ba)(ba)(ba)(ba)的邊(bian)緣延伸到基(ji)片(pian)區域，從而部(bu)分(fen)電子(zi)可(ke)(ke)以沿(yan)著磁(ci)(ci)(ci)(ci)力(li)(li)(li)線(xian)(xian)擴展到基(ji)片(pian)，增(zeng)加基(ji)片(pian)區域的等(deng)離(li)(li)(li)子(zi)體(ti)(ti)密度和(he)(he)氣(qi)體(ti)(ti)電離(li)(li)(li)率(lv)(lv)。不管平(ping)(ping)(ping)衡(heng)還是非平(ping)(ping)(ping)衡(heng)，若(ruo)磁(ci)(ci)(ci)(ci)鐵(tie)靜(jing)止(zhi)，其磁(ci)(ci)(ci)(ci)場(chang)(chang)(chang)特性決定了(le)一般靶(ba)(ba)(ba)(ba)材利(li)用(yong)(yong)(yong)率(lv)(lv)小(xiao)于(yu)(yu)30%。為(wei)增(zeng)大(da)(da)靶(ba)(ba)(ba)(ba)材利(li)用(yong)(yong)(yong)率(lv)(lv)，可(ke)(ke)采用(yong)(yong)(yong)旋轉(zhuan)磁(ci)(ci)(ci)(ci)場(chang)(chang)(chang)。但旋轉(zhuan)磁(ci)(ci)(ci)(ci)場(chang)(chang)(chang)需要旋轉(zhuan)機構，同時濺(jian)射速率(lv)(lv)要減小(xiao)。旋轉(zhuan)磁(ci)(ci)(ci)(ci)場(chang)(chang)(chang)多用(yong)(yong)(yong)于(yu)(yu)大(da)(da)型或貴(gui)重靶(ba)(ba)(ba)(ba)，如(ru)半導(dao)體(ti)(ti)膜(mo)濺(jian)射。對于(yu)(yu)小(xiao)型設備和(he)(he)一般工(gong)業設備，多用(yong)(yong)(yong)磁(ci)(ci)(ci)(ci)場(chang)(chang)(chang)靜(jing)止(zhi)靶(ba)(ba)(ba)(ba)源。